10CL010YM164I7G - Cyclone 10 LP FPGA 10K LE | Intel | Industrial
MPN: 10CL010YM164I7G ✓ Aktif10CL010YM164I7G Ringkasan
An FPGA is a reconfigurable logic device whose interconnect and function are defined after manufacture, placing it between fixed-function ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility at the logic level). Cyclone 10 LP sits inside Intel's low-power FPGA family and is commonly used as a glue-logic and parallel-I/O expansion companion to an applications processor. The 10CL010YM164I7G is the 164-MBGA member of the 10CL010 die, offering the highest I/O count in this density at this package size.
Key features include 10,320 logic elements, 423,936 bits (414 Kb) of embedded SRAM, 23 embedded 18 x 18 multipliers, two general-purpose PLLs per device, and configuration support via JTAG, Active Serial (AS), and Passive Serial (PS) modes. The device uses a 1.2 V core with separate, user-selectable I/O bank voltages, allowing LVCMOS 1.2 V through 3.3 V and LVDS signaling on the same die.
Architecturally, the 10CL010YM164I7G is built on a low-power process variant of the Cyclone 10 family, with hard memory blocks, hard multiplier blocks, and variable-precision DSP capability. Two PLLs provide clock multiplication, division, and phase shifting for system timing.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image aggregation, IoT edge gateways, and portable or battery-powered instrumentation. Designers also use this device as a low-cost companion to higher-performance SoCs for parallel sensor aggregation, custom high-speed interfaces, and legacy bus bridging (PCI, ISA, SRAM).
When designing with this device, validate that your I/O bank assignment matches the required signaling standard for each interface, and respect the LVDS I/O count limit per bank. Use Intel Quartus Prime Lite Edition for synthesis, place-and-route, and timing closure; the device is supported by the free Quartus Prime toolchain.
This page synthesizes authorized-distributor pricing, drop-in alternatives, and engineering guidance compiled from the Cyclone 10 LP datasheet and reference designs - context not bundled in the standalone PDF.
Pilihan pengganti yang segera untuk 10CL010YM164I7G — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera 10CL010YM164I7G (sama faktor bentuk dan kaki) — berbeza dalam Package, Embedded Memory, Core Voltage, Configuration Modes, PLLs.
10CL010YM164C8G
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →10CL010YM164C6G
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →10CL010YM164A7G
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →10CL006YM164I7G
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
10CL010YM164I7G Penilaian maksimum & Ciri-ciri Elektrik
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 423,936 bits (414 Kb) |
| Embedded 18 x 18 Multipliers | 23 |
| Maximum User I/O Pins | 101 |
| General-Purpose PLLs | 2 |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) |
| Gambaran Suhu Operasi | -40 °C to 100 °C (Industrial) |
| Kemasan | 164-ball MBGA (8 mm x 8 mm) |
| Jenis Pemasangan | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| I/O Signaling Standards | LVCMOS 1.2 V to 3.3 V, LVDS |
| Process Node | TSMC low-power process |
| Status RoHS | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for BGA) |
Panduan Konfigurasi Pin 10CL010YM164I7G 164-ball mbga (8 mm x 8 mm)
Konfigurasi pin untuk 10CL010YM164I7G (164-ball mbga (8 mm x 8 mm) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk 10CL010YM164I7G.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
10CL010YM164I7G patut untuk 6 aplikasis: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Image Aggregation, IoT Edge Gateway, Portable Test and Measurement, Legacy Bus Bridging (PCI/ISA/SRAM).
Industrial Motor Control
The Intel 10CL010YM164I7G is widely adopted in industrial motor drives, where its 101 user I/O pins and two PLLs enable multi-axis field-oriented control (FOC). With 10,320 logic elements and 23 embedded 18 x 18 multipliers, the device handles encoder interfaces (QEI/SSI/BiSS), PWM generation, and the FOC math loop at switching frequencies up to 20 kHz. The industrial -40 C to 100 C temperature range supports cabinet and on-motor mounting. Designers typically place this Cyclone 10 LP FPGA between an MCU host and the power stage, offloading real-time control from the processor. Companion parts include the EPCQ16 configuration Flash for remote in-system updates.
Disebarkan
Factory Automation I/O Expansion
In factory-automation PLCs and distributed I/O nodes, the 10CL010YM164I7G acts as a programmable interface between field sensors/actuators and a backplane controller. Its 101 LVCMOS/LVDS-capable I/O pins aggregate multiple 24 V digital inputs through optocouplers and produce PWM/encoder outputs to stepper and servo amplifiers. The 1.2 V core plus independent I/O bank voltages let one FPGA bridge 3.3 V logic, 5 V legacy buses, and 24 V industrial signaling in a single device. Embedded 414 Kbit of SRAM buffers burst sensor data without external memory. Use the Quartus Prime Lite Edition for free synthesis of custom industrial protocols.
Disebarkan
Video Bridging and Image Aggregation
The 10CL010YM164I7G serves as a low-cost video bridge in machine-vision and surveillance gateways. Its LVDS I/O supports MIPI CSI-2 receive and parallel RGB/YCbCr aggregation from image sensors up to 1080p30, while the 23 embedded 18 x 18 multipliers perform real-time color-space conversion and image scaling. The 414 Kbit of embedded memory acts as a line buffer, eliminating external SRAM for many single-camera streams. Compared with an ASIC, the FPGA allows rapid customization for new sensor interfaces; compared with a high-end SoC, it reduces BOM cost and standby power.
Disebarkan
IoT Edge Gateway
The 10CL010YM164I7G is a strong fit for IoT edge gateways that must aggregate multiple wireless protocols (Wi-Fi, BLE, LoRa, Sub-GHz) and present a unified data stream to a host processor. Its two PLLs derive independent reference clocks for each radio, while 10K logic elements implement custom MAC-layer glue and protocol translation. The 1.2 V core keeps standby power low for solar or battery-powered edge nodes, and the 164-MBGA package fits a 25 mm x 25 mm PCB area. Pair this Cyclone 10 LP FPGA with an ESP32 host MCU for cloud connectivity.
Disebarkan
Portable Test and Measurement
Portable oscilloscopes, logic analyzers, and protocol testers often use the 10CL010YM164I7G as their front-end signal-conditioning and timing engine. Its 101 user I/O pins accept multiple logic-level inputs (1.2 V to 3.3 V LVCMOS), and the two PLLs synthesize the precise sample clocks needed for high-speed capture. The 414 Kbit of embedded memory acts as a deep FIFO buffer between the analog front-end and the host display controller. Low static power consumption extends battery runtime in handheld instruments, while the industrial temperature grade supports field-deployed test gear.
Disebarkan
Legacy Bus Bridging (PCI/ISA/SRAM)
Industrial and aerospace systems frequently need bridges between modern processors and legacy parallel buses (PCI, ISA, SRAM, FIFO). The 10CL010YM164I7G is well suited because its 10,320 logic elements implement the bus-state machines and timing constraints while 101 user I/O pins carry the multi-bit parallel data. The Cyclone 10 LP family's low static power is preferable to older FPGAs when adding bridge logic to long-lifecycle equipment. Reference designs in the Cyclone 10 LP handbook demonstrate PCI 32-bit 33 MHz target bridges and SRAM controllers on this device.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk 10CL010YM164I7G — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | 10CL010YM164C8G | 10CL010YM164C6G | 10CL010YM164A7G | 10CL006YM164I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 164-ball MBGA (8 mm x 8 mm) | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 6,272 (-39%) |
| Embedded Memory | 423,936 bits (414 Kb) | 423,936 bits | 423,936 bits | 423,936 bits | 276,480 bits (-35%) |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 23 | 15 (-35%) |
| Maximum User I/O | 101 | 101 | 101 | 101 | 101 (same) |
| Temperature Grade | Industrial (-40 C to 100 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Automotive (A7 speed grade) | Industrial |
| Speed Grade | I7 (industrial) | C8 (slower) | C6 (faster) | A7 (automotive) | I7 |
Penyeberangsung Jelas
- Largest I/O count in the 10CL010 die at 8 mm x 8 mm (vs10CL010YE144I7G (144-EQFP))
- Lowest static power in the Cyclone family at this density (vsCyclone IV EP4CE10 (legacy))
- Free toolchain support via Quartus Prime Lite Edition (vsXilinx Spartan-6 (legacy))
Catatan Desain
The Cyclone 10 LP core draws from a 1.15 V to 1.25 V VCCINT rail; use a dedicated LDO such as the TI TPS7A4515 or TPS7A4701 downstream of a 3.3 V or 5 V system rail. Decoupling: place 0.1 uF X7R capacitors within 2 mm of every VCCINT and VCCPD ball, plus a single 10 uF bulk capacitor near the FPGA. The I/O banks (VCCIO) require a separate rail per bank voltage; miswired bank voltages can permanently damage the device. Estimated idle power at 25 C with all I/O tri-stated is approximately 100 mW; activate unused I/O banks to ground through the Quartus pin planner to suppress leakage.
Route all MBGA fan-out on inner layers using micro-vias or via-in-pad to escape the 0.5 mm ball pitch of the 164-MBGA package. Maintain a continuous reference ground plane under the device and stitch the BGA perimeter with ground vias every 2 mm to reduce EMI and provide a low-impedance return path for high-speed LVDS pairs. The exposed die-attach pad must be soldered to the PCB central thermal pad with a 4 x 4 via array to a ground plane. Recommended stack-up: 8-layer, 1 oz copper outer, 0.5 oz inner, with the second layer reserved as a continuous ground plane.
Configure the FPGA through JTAG (10-pin header) for development and through Active Serial (AS) mode using an EPCQ16 or EPCQ32 quad-serial configuration Flash for production. AS mode allows field upgrades by writing a new image to the EPCQ via JTAG or via the FPGA in-system. Hold the nCONFIG pin low during power-up until all rails are stable; otherwise the FPGA may enter an undefined configuration state and require a power cycle. When designing for functional safety, the watchdog configuration scheme (two EPCQ images with CRC checking) is recommended per the Cyclone 10 LP handbook.
Maklumat Kesediaan
RoHS and lead-free per Intel Cyclone 10 LP product page. AEC-Q100 qualified variants are available in the 10CL010YM164A7G speed grade for automotive applications; the I7G part is industrial grade (-40 C to 100 C).
