10CX150YF780I6G vs 10CX150YF780E6G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10CX150YF780I6G disebabkan oleh Intel dan 10CX150YF780E6G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10CX150YF780I6G | 10CX150YF780E6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone 10 GX | Cyclone 10 GX |
| Logic Elements (LE) | 150,000 | 150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 56,480 |
| Embedded Memory (M20K blocks) | [DATA_NEEDED: M20K block count] | — |
| Embedded Memory (total bits) | 10,907,648 bits | — |
| DSP Blocks (18x19 multipliers) | 484 | — |
| Transceivers | Up to 12 (3.125 Gbps) | GX up to 12.5 Gbps |
| User I/O Pins | [DATA_NEEDED: user I/O count for F780 package] | 284 |
| Kemasan | 780-ball FBGA (F780) | 780-ball FCBGA |
| Process Node | 20 nm | — |
| Speed Grade | I6G (industrial, -40C to +100C junction) | -6 (E6G industrial fast) |
| Temperature Range | Industrial: -40C to +100C (TJ) | — |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR3 | — |
| Hard PCIe | PCIe Gen2 (x1/x2/x4 hard IP) | — |
| Configuration | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Status RoHS | Compliant (per distributor listing) | Compliant |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Jenis Pemasangan | Surface Mount (FBGA) | Surface Mount (FCBGA) |
| Series | — | Cyclone 10 GX |
| Process Technology | — | 20 nm |
| Embedded Memory | — | 10,907,648 bits (approximately 10.9 Mbit) |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| PCIe Hard IP | — | PCI Express Gen2 x4 hard IP |
| DSP Blocks | — | Variable-precision, fixed/floating point |
| Memory Interfaces | — | DDR3, DDR4, LPDDR3, QDR II+ |
| Lead-Free | — | Yes |