10M08DCF256C8G vs 10M08DCF256I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DCF256C8G disebabkan oleh Intel dan 10M08DCF256I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DCF256C8G | 10M08DCF256I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | MAX 10 |
| Logic Elements | 8,000 | — |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) | 387,072 |
| User I/O Count | 178 | 178 |
| Kemasan | 256-LBGA (F256, FineLine BGA) | 256-FBGA (FineLine BGA) |
| Pitch | 1.0 mm | — |
| Speed Grade | C8 (commercial, slowest speed bin) | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Configuration | Internal flash (instant-on, non-volatile) | — |
| ADC | Dual 12-bit SAR, up to 17 analog inputs | — |
| 18x18 Multipliers | 8 | — |
| PLLs | 2 | — |
| Global Clock Networks | 4 | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm NOR-flash-backed CMOS |
| Suhu Operasi | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (168 hours) | — |
| Family | — | MAX 10 FPGA |
| Logic Elements (LE) | — | 8,000 |
| DSP Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage range] |
| Supply Voltage - I/O Banks | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Configuration Memory | — | On-chip dual-configuration flash (non-volatile) |
| On-die ADC | — | 12-bit, up to 1 MSa/s |
| External Memory Interface | — | LPDDR2 / DDR3 / DDR3L |
| Lead-Free | — | Yes |