10M08SAU324I7G vs 10M08DAU324I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08SAU324I7G disebabkan oleh Intel dan 10M08DAU324I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08SAU324I7G | 10M08DAU324I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 8000 | 8,000 |
| Embedded User Flash | 387,072 bits | — |
| General Purpose SRAM | 246 Kbits | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | 2 (with up to 4 output taps) | 4 |
| Maximum User I/O Pins | 250 | — |
| On-chip ADC | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS |
| Core Voltage (VCC) | 1.2 V | — |
| Tegangan Pemberi Arus Operasi | 3 V / 3.3 V | — |
| Kemasan | 324-LFBGA (UBGA-324), 15x15 mm | 324-LFBGA (UBGA), 1.0 mm pitch |
| Configuration Memory | On-die flash (non-volatile) | — |
| Configuration Interface | JTAG (IEEE 1149.1), Active Serial | — |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Series | — | MAX 10 |
| Embedded Memory (M9K blocks) | — | 378 Kbits |
| User Flash Memory | — | 387,072 bits |
| Maximum User I/O | — | 246 |
| Supply Voltage (Core) | — | 1.2 V typical |
| Supply Voltage (I/O Banks) | — | 1.2 V to 3.3 V |
| Process Technology | — | TSMC 55 nm embedded flash |
| DSP Blocks (18x18 Multipliers) | — | 24 |
| Configuration | — | Internal flash, JTAG, Passive Serial |
| Aras MSL | — | 3 |