10M16DAF256I7G vs 10M16DAF256C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M16DAF256I7G disebabkan oleh Intel dan 10M16DAF256C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M16DAF256I7G | 10M16DAF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements (LE) | 16000 | 16000 |
| Embedded Memory Bits | 562176 | 562176 (549 Kbit) |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) | — |
| Maximum User I/O | 178 | 178 |
| I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Suhu Operasi | -40C to +100C (industrial) | 0C to +85C (C7G suffix = commercial) |
| Speed Grade | 7 (fastest) | 7 |
| Kemasan | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-LBGA (F256), 17x17 mm |
| Configuration Memory | On-die flash (non-volatile, instant-on) | Dual-configuration flash (non-volatile) |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Process Technology | 55 nm CMOS with embedded flash | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020, BGA package) |
| Product Family | — | MAX 10 |
| Embedded RAM Blocks | — | M9K, 69 blocks (per family datasheet) |
| User Flash Memory (UFM) | — | [DATA_NEEDED: UFM size in kB] |
| 18x18 Hardware Multipliers | — | [DATA_NEEDED: multiplier count] |
| Integrated ADC | — | Yes, 12-bit SAR (per MAX 10 family) |
| Supply Voltage - Core | — | 1.2 V (dual-supply variants) |
| Supply Voltage - I/O | — | 3.3 V (or LVCMOS 1.2-3.3 V per bank) |