10M16DAF256I7G vs 10M16DAF256C7G 比較
詳細並排比較 10M16DAF256I7G 由 Intel 與 10M16DAF256C7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M16DAF256I7G | 10M16DAF256C7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | MAX 10 | — |
| Logic Elements (LE) | 16000 | 16000 |
| Embedded Memory Bits | 562176 | 562176 (549 Kbit) |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) | — |
| Maximum User I/O | 178 | 178 |
| I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| 工作溫度 | -40C to +100C (industrial) | 0C to +85C (C7G suffix = commercial) |
| Speed Grade | 7 (fastest) | 7 |
| 封裝 | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-LBGA (F256), 17x17 mm |
| Configuration Memory | On-die flash (non-volatile, instant-on) | Dual-configuration flash (non-volatile) |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Process Technology | 55 nm CMOS with embedded flash | — |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020, BGA package) |
| Product Family | — | MAX 10 |
| Embedded RAM Blocks | — | M9K, 69 blocks (per family datasheet) |
| User Flash Memory (UFM) | — | [DATA_NEEDED: UFM size in kB] |
| 18x18 Hardware Multipliers | — | [DATA_NEEDED: multiplier count] |
| Integrated ADC | — | Yes, 12-bit SAR (per MAX 10 family) |
| Supply Voltage - Core | — | 1.2 V (dual-supply variants) |
| Supply Voltage - I/O | — | 3.3 V (or LVCMOS 1.2-3.3 V per bank) |