10M25DAF484C7G vs 10M25DAF484A7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF484C7G disebabkan oleh Intel dan 10M25DAF484A7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF484C7G | 10M25DAF484A7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory (M9K blocks) | 1,728 Kbit | — |
| Embedded 18x18 Multipliers | 66 | — |
| User I/O Pins (max) | 360 | — |
| Kemasan | 484-BGA (F484) | 484-ball Plastic BGA (S-PBGA-B484) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| On-chip Configuration Flash | Dual-configuration (instant-on, remote update) | — |
| Hard IP: ADC | 12-bit, 1 MSPS, 16-channel (MAX 10 family) | — |
| PLLs | 4 general-purpose | 2 (general-purpose) |
| Global Clocks | 20 | — |
| On-chip Temperature Sensor | Yes | — |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Status RoHS | Compliant | Compliant |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Logic Elements | — | 25,000 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Process Technology | — | 55 nm non-volatile |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| Speed Grade | — | A7 |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| On-chip ADC | — | 1 x 12-bit, 1 MSPS |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| Tegangan Pemberi Arus | — | 3.3 V or 1.8 V single supply |