10M50SAE144C8G vs 10M40SAE144C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50SAE144C8G disebabkan oleh Intel dan 10M40SAE144C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50SAE144C8G | 10M40SAE144C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 50000 | 40,000 |
| Embedded Memory | 1677312 bits (approx. 1.6 Mbit) | — |
| Maximum User I/Os | 101 | — |
| Kemasan | 144-LQFP Exposed Pad (EQFP-144) | 144-EQFP (LQFP with exposed pad), 22x22 mm, 0.50 mm pitch |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch | — |
| Suhu Operasi | 0C to +85C (Commercial, "C8" grade) | 0C to +85C (commercial) |
| Supply Voltage - Core | [DATA_NEEDED: core Vcc] | — |
| Process Technology | 55 nm embedded flash CMOS | — |
| Configuration | Non-volatile, single-chip (on-chip flash) | — |
| On-chip User Flash | Up to 1.4 Mbit | — |
| ADC | 12-bit successive-approximation, up to 17 channels | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| I/O Standards | LVCMOS, LVDS, SSTL, RSDS, PCI | — |
| Hot Socketing | Yes | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 | 3 |
| Thermal Resistance (Theta-JA) | [DATA_NEEDED: theta-JA C/W] | — |
| Embedded Memory (bits) | — | 1,290,240 |
| M9K Memory Blocks | — | 51 |
| 18x18 Multipliers | — | 156 |
| User I/O Count | — | 101 |
| Speed Grade | — | C8 |
| Logic Level | — | 3.3 V LVCMOS/LVTTL |
| Configuration Memory | — | Internal non-volatile flash (single-chip instant-on) |
| Transceivers (GXB) | — | 8 |
| Integrated ADC | — | 12-bit SAR, up to 1 MSa/s |