5CSEBA5U19C7SN vs 5CSEBA5U19C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CSEBA5U19C7SN disebabkan oleh Intel dan 5CSEBA5U19C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 5CSEBA5U19C7SN | 5CSEBA5U19C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device | 5CSEA5 | — |
| Logic Elements | 85,000 | 85,000 |
| Embedded Memory | 3.74 Mb | M10K + MLAB blocks, ~4,450 Kbits total |
| DSP 18x18 Multipliers | 224 | — |
| Hard Processor System | Single ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz | 800 MHz per core |
| User I/O Pins | [DATA_NEEDED: user I/O count for U19 package] | — |
| Process Technology | 28 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| Kemasan | 484-pin UBG (19x19 mm) | 484-UBGA (UBGAmobile, 19x19 mm) |
| Package Code | FBGA / UBG | — |
| Operating Temperature Grade | Commercial (suffix C7) | — |
| Speed Grade | 7 | -7 (standard) |
| Status RoHS | Compliant | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Suhu Operasi | — | 0C to +85C (commercial, junction) |
| Process Node | — | 28 nm low-power (TSMC) |
| Supply Voltage (Core) | — | 1.1 V typical |
| DSP Blocks | — | Variable-precision, 18x18 / 27x27 multipliers |
| HPS Peripherals | — | EMAC, USB 2.0 OTG, NAND, DDR3, SPI, QSPI, I2C, UART |
| RoHS / Pb-free | — | Yes |
| Configuration Memory | — | External (active serial via HPS or FPGA) |
| Aras MSL | — | 3 (per JEDEC J-STD-020, reflow 260C) |
| Block Pins (User I/O) | — | Approximately 66 user I/O pins |