A3P1000-FGG256M vs A3P1000-FGG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P1000-FGG256M disebabkan oleh Microchip Technology dan A3P1000-FGG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3P1000-FGG256I - 1M Gate ProASIC3 FPGA, 256-FBGA | Microchip
A3P1000-FGG256I ✓ AktifPengandingan Spesifikasi
| Parametr | A3P1000-FGG256M | A3P1000-FGG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | ProASIC3 | — |
| Number of Logic Elements | 11KLEs | — |
| Number of I/O | 177 | — |
| RAM Bits | 147456 | — |
| Number of I/O Banks | 4 | 4 |
| Kemasan / Case | 256-LBGA | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Supplier Package | FBGA | — |
| Core Supply Voltage | [DATA_NEEDED: Core Supply Voltage] | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: Operating Temperature Range] | -40C to +85C |
| Maximum Operating Frequency | [DATA_NEEDED: Maximum Operating Frequency] | — |
| Speed Grade | [DATA_NEEDED: Speed Grade] | — |
| Total System Gates | [DATA_NEEDED: Total System Gates] | — |
| I/O Standards Supported | [DATA_NEEDED: I/O Standards Supported] | — |
| Status RoHS | [DATA_NEEDED: RoHS Status] | Compliant |
| Family | — | ProASIC3 (A3P1000) |
| Logic Elements | — | 11,000 |
| System Gates | — | 1,000,000 |
| Embedded SRAM | — | 147,456 bits |
| Distributed SRAM | — | 1.5 Kbits |
| Maximum User I/O | — | 177 |
| Configuration Memory | — | Flash (non-volatile, live-at-power-up) |
| PLLs | — | Yes, on-chip |
| Kemasan | — | 256-ball FBGA (FGG256), 1.0 mm pitch |
| Temperature Grade | — | Industrial (-40C to +85C) |
| Lead-Free / Halogen-Free | — | Yes (per Microchip product page) |