A3P1000-FGG256M vs A3P1000-FGG256I 比較

詳細並排比較 A3P1000-FGG256M 由 Microchip Technology 與 A3P1000-FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3P1000-FGG256M A3P1000-FGG256M ProASIC3 FPGA 256-LBGA | Microchip

A3P1000-FGG256M ProASIC3 FPGA 256-LBGA | Microchip

A3P1000-FGG256M ✓ 啟用中
Microchip Technology
A3P1000-FGG256I A3P1000-FGG256I - 1M Gate ProASIC3 FPGA, 256-FBGA | Microchip

A3P1000-FGG256I - 1M Gate ProASIC3 FPGA, 256-FBGA | Microchip

A3P1000-FGG256I ✓ 啟用中

規格比較

參數 A3P1000-FGG256M A3P1000-FGG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series ProASIC3 —
Number of Logic Elements 11KLEs —
Number of I/O 177 —
RAM Bits 147456 —
Number of I/O Banks 4 4
封裝 / 外殼 256-LBGA —
安裝類型 Surface Mount Surface Mount
Supplier Package FBGA —
Core Supply Voltage [DATA_NEEDED: Core Supply Voltage] —
工作溫度範圍 [DATA_NEEDED: Operating Temperature Range] -40C to +85C
Maximum Operating Frequency [DATA_NEEDED: Maximum Operating Frequency] —
Speed Grade [DATA_NEEDED: Speed Grade] —
Total System Gates [DATA_NEEDED: Total System Gates] —
I/O Standards Supported [DATA_NEEDED: I/O Standards Supported] —
RoHS 狀態 [DATA_NEEDED: RoHS Status] Compliant
Family — ProASIC3 (A3P1000)
Logic Elements — 11,000
System Gates — 1,000,000
Embedded SRAM — 147,456 bits
Distributed SRAM — 1.5 Kbits
Maximum User I/O — 177
Configuration Memory — Flash (non-volatile, live-at-power-up)
PLLs — Yes, on-chip
封裝 — 256-ball FBGA (FGG256), 1.0 mm pitch
Temperature Grade — Industrial (-40C to +85C)
Lead-Free / Halogen-Free — Yes (per Microchip product page)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價