A3P600-FGG484 vs A3P600-2FG484 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P600-FGG484 disebabkan oleh Microchip Technology dan A3P600-2FG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | A3P600-FGG484 | A3P600-2FG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600K |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | 130nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5V |
| User I/O Count | 235 | — |
| Kemasan | 484-Pin FBGA (FGG484) | 484-BGA (FBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | — |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| Status RoHS | Lead Free | Compliant |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Logic Elements (LEs) | — | 7K LEs (approx.) |
| User I/Os | — | 235 |
| RAM Bits | — | 110592 |
| Maximum System Performance | — | 310 MHz |
| I/O Banks | — | 4 |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Configuration | — | Flash-based |
| Lead-Free | — | Yes |