A3P600-FGG484 vs A3P600-2FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-FGG484 sa pamamagitan ng Microchip Technology at A3P600-2FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-2FG484 - ProASIC3 FPGA, 600K Gates | Microchip
A3P600-2FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-FGG484 | A3P600-2FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600K |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | 130nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5V |
| User I/O Count | 235 | — |
| Packhaging | 484-Pin FBGA (FGG484) | 484-BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | — |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| Tindminan RoHS | Lead Free | Compliant |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Logic Elements (LEs) | — | 7K LEs (approx.) |
| User I/Os | — | 235 |
| RAM Bits | — | 110592 |
| Maximum System Performance | — | 310 MHz |
| I/O Banks | — | 4 |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Configuration | — | Flash-based |
| Lead-Free | — | Yes |