A3PE3000L-FG324 vs A3PE3000L-FGG324I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FG324 disebabkan oleh Microsemi dan A3PE3000L-FGG324I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-FG324 | A3PE3000L-FGG324I |
|---|---|---|
| Merek | Microsemi | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3EL (ProASIC3E Low Power) | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Kemasan | 324-ball FBGA | 324-BGA FBGA (19x19 mm) |
| Configuration Memory | On-chip flash (non-volatile, single chip) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (SMD) |
| Max Reported Frequency (parameter listing) | 781.25 MHz (per FindIC parameter data) | — |
| Status RoHS | RoHS Non-Compliant (contains lead, FG variant) | RoHS Compliant |
| Lead Free Status | Contains Lead (FG variant); choose FGG variant for lead-free | Lead Free |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature] | -40C to +100C (industrial) |
| Embedded Memory | [DATA_NEEDED: Embedded Memory] | — |
| DLL/PLL Blocks | [DATA_NEEDED: DLL/PLL Blocks] | — |
| Aras MSL | [DATA_NEEDED: MSL Level] | — |
| Programming Method | In-system / on-board flash programming | — |
| Total RAM Bits | — | 516096 |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | — | Single-chip, no external boot PROM |
| Packaging | — | Tray |
| Number of Package Balls | — | 324 |