A3PE3000L-FG324 vs A3PE3000L-FGG324I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG324 sa pamamagitan ng Microsemi at A3PE3000L-FGG324I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG324 | A3PE3000L-FGG324I |
|---|---|---|
| Brand | Microsemi | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3EL (ProASIC3E Low Power) | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Packhaging | 324-ball FBGA | 324-BGA FBGA (19x19 mm) |
| Configuration Memory | On-chip flash (non-volatile, single chip) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMD) |
| Max Reported Frequency (parameter listing) | 781.25 MHz (per FindIC parameter data) | — |
| Tindminan RoHS | RoHS Non-Compliant (contains lead, FG variant) | RoHS Compliant |
| Lead Free Status | Contains Lead (FG variant); choose FGG variant for lead-free | Lead Free |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature] | -40C to +100C (industrial) |
| Embedded Memory | [DATA_NEEDED: Embedded Memory] | — |
| DLL/PLL Blocks | [DATA_NEEDED: DLL/PLL Blocks] | — |
| Level ng MSL | [DATA_NEEDED: MSL Level] | — |
| Programming Method | In-system / on-board flash programming | — |
| Total RAM Bits | — | 516096 |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | — | Single-chip, no external boot PROM |
| Packaging | — | Tray |
| Number of Package Balls | — | 324 |