A3PE3000L-FGG324I vs A3PE3000L-FG324 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FGG324I disebabkan oleh Microchip Technology dan A3PE3000L-FG324 disebabkan oleh Microsemi. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-FGG324I | A3PE3000L-FG324 |
|---|---|---|
| Merek | Microchip Technology | Microsemi |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Flash FPGA) | ProASIC3EL (ProASIC3E Low Power) |
| System Gates | 3,000,000 | 3000000 |
| Total RAM Bits | 516096 | — |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130 nm CMOS | 130 nm CMOS flash |
| Kemasan | 324-BGA FBGA (19x19 mm) | 324-ball FBGA |
| Jenis Pemasangan | Surface Mount (SMD) | Surface Mount |
| Suhu Operasi | -40C to +100C (industrial) | [DATA_NEEDED: Operating Temperature] |
| Technology Features | Nonvolatile Flash, Instant On, Flash*Freeze | — |
| Configuration | Single-chip, no external boot PROM | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | Contains Lead (FG variant); choose FGG variant for lead-free |
| Status RoHS | RoHS Compliant | RoHS Non-Compliant (contains lead, FG variant) |
| Number of Package Balls | 324 | — |
| Configuration Memory | — | On-chip flash (non-volatile, single chip) |
| Max Reported Frequency (parameter listing) | — | 781.25 MHz (per FindIC parameter data) |
| Embedded Memory | — | [DATA_NEEDED: Embedded Memory] |
| DLL/PLL Blocks | — | [DATA_NEEDED: DLL/PLL Blocks] |
| Aras MSL | — | [DATA_NEEDED: MSL Level] |
| Programming Method | — | In-system / on-board flash programming |