A3PE3000L-FGG324I vs A3PE3000L-FG324 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FGG324I sa pamamagitan ng Microchip Technology at A3PE3000L-FG324 sa pamamagitan ng Microsemi. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FGG324I | A3PE3000L-FG324 |
|---|---|---|
| Brand | Microchip Technology | Microsemi |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash FPGA) | ProASIC3EL (ProASIC3E Low Power) |
| System Gates | 3,000,000 | 3000000 |
| Total RAM Bits | 516096 | — |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130 nm CMOS | 130 nm CMOS flash |
| Packhaging | 324-BGA FBGA (19x19 mm) | 324-ball FBGA |
| Uri ng Pagpapasok | Surface Mount (SMD) | Surface Mount |
| Temperature na Operasyon | -40C to +100C (industrial) | [DATA_NEEDED: Operating Temperature] |
| Technology Features | Nonvolatile Flash, Instant On, Flash*Freeze | — |
| Configuration | Single-chip, no external boot PROM | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | Contains Lead (FG variant); choose FGG variant for lead-free |
| Tindminan RoHS | RoHS Compliant | RoHS Non-Compliant (contains lead, FG variant) |
| Number of Package Balls | 324 | — |
| Configuration Memory | — | On-chip flash (non-volatile, single chip) |
| Max Reported Frequency (parameter listing) | — | 781.25 MHz (per FindIC parameter data) |
| Embedded Memory | — | [DATA_NEEDED: Embedded Memory] |
| DLL/PLL Blocks | — | [DATA_NEEDED: DLL/PLL Blocks] |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |
| Programming Method | — | In-system / on-board flash programming |