A3PE3000L-FGG324I vs A3PE3000L-FG324 比較

詳細並排比較 A3PE3000L-FGG324I 由 Microchip Technology 與 A3PE3000L-FG324 由 Microsemi. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3PE3000L-FGG324I A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I ✓ 啟用中
Microsemi
A3PE3000L-FG324 A3PE3000L-FG324 - 3M-Gate ProASIC3EL Flash FPGA | Microsemi

A3PE3000L-FG324 - 3M-Gate ProASIC3EL Flash FPGA | Microsemi

A3PE3000L-FG324 ✓ 啟用中

規格比較

參數 A3PE3000L-FGG324I A3PE3000L-FG324
品牌 Microchip Technology Microsemi
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family ProASIC3L (Flash FPGA) ProASIC3EL (ProASIC3E Low Power)
System Gates 3,000,000 3000000
Total RAM Bits 516096 —
User I/O 221 221
Core Voltage 1.2 V to 1.5 V 1.2 V (supports 1.2 V to 1.5 V)
Process Technology 130 nm CMOS 130 nm CMOS flash
封裝 324-BGA FBGA (19x19 mm) 324-ball FBGA
安裝類型 Surface Mount (SMD) Surface Mount
工作溫度 -40C to +100C (industrial) [DATA_NEEDED: Operating Temperature]
Technology Features Nonvolatile Flash, Instant On, Flash*Freeze —
Configuration Single-chip, no external boot PROM —
Packaging Tray —
Lead Free Status Lead Free Contains Lead (FG variant); choose FGG variant for lead-free
RoHS 狀態 RoHS Compliant RoHS Non-Compliant (contains lead, FG variant)
Number of Package Balls 324 —
Configuration Memory — On-chip flash (non-volatile, single chip)
Max Reported Frequency (parameter listing) — 781.25 MHz (per FindIC parameter data)
Embedded Memory — [DATA_NEEDED: Embedded Memory]
DLL/PLL Blocks — [DATA_NEEDED: DLL/PLL Blocks]
MSL 等級 — [DATA_NEEDED: MSL Level]
Programming Method — In-system / on-board flash programming

資料表與資源

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