A3PE3000L-FGG896 vs A3PE3000L-1FGG896 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FGG896 disebabkan oleh Microchip Technology dan A3PE3000L-1FGG896 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
A3PE3000L-FGG896 ✓ AktifMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-FGG896 | A3PE3000L-1FGG896 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | 75264 |
| Total SRAM | 504 kbits | — |
| User I/Os (FGG896) | 620 | — |
| Kemasan | 896-ball FBGA (FGG896), 1.0 mm pitch | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Core Supply Voltage | 1.2 V to 1.5 V | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage range] | — |
| Suhu Operasi | 0 C to +70 C | — |
| Logic Family | CMOS | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based | 130 nm flash |
| Flash*Freeze Support | Yes | — |
| Live-At-Power-Up | Level 0 support | — |
| Reconfiguration | Reprogrammable (in-system programmable) | — |
| Lead-Free Finish | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Clock Inputs | [DATA_NEEDED: number of clock conditioning circuits/PLLs] | — |
| Speed Grade | [DATA_NEEDED: speed grade for -FGG896 base part] | -1 |
| Power Consumption | [DATA_NEEDED: typical static/dynamic power] | — |
| Ball Count | 896 | — |
| Family | — | ProASIC3L |
| User I/O | — | 620 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| Core Voltage | — | 1.2 V (supports 1.2 V to 1.5 V) |
| I/O Voltage | — | As low as 1.2 V |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |