AFS600-1FGG256 vs M7AFS600-1FGG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci AFS600-1FGG256 disebabkan oleh Microchip Technology dan M7AFS600-1FGG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ AktifMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ AktifPengandingan Spesifikasi
| Parametr | AFS600-1FGG256 | M7AFS600-1FGG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| System Gates | 600,000 gates | 600K |
| User I/O | 119 I/O | — |
| Tegangan Pemberi Arus | 1.5 V | — |
| Logic Family | Flash-based CMOS | — |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal flash-based CMOS |
| Metal Layers | 7 layers | — |
| Package Type | 256-ball FBGA | — |
| Package Pin Count | 256 balls | — |
| Package Pitch | 1.0 mm | — |
| Suhu Operasi | 0°C to 70°C | — |
| Configuration Memory | Embedded nonvolatile flash | Flash (nonvolatile) |
| Power-Up Configuration | Live at power-up | — |
| Integrated Analog Resources | Configurable analog blocks | — |
| Integrated Clock Management | Clock generation and management | — |
| Embedded Memory | Large flash memory blocks | — |
| Package Family | FBGA surface-mount package family | — |
| Status RoHS | RoHS compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead-free | — |
| Pin Assignments | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| Tegangan Pemberi Arus Operasi | — | 1.5 V |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -1 |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Kemasan / Case | — | 256-Ball FBGA (FGG256) |
| Gaya Pemasangan | — | SMD/SMT |
| Packaging | — | Tray |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |