AFS600-1FGG256 vs M7AFS600-1FGG256I 比較
詳細並排比較 AFS600-1FGG256 由 Microchip Technology 與 M7AFS600-1FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ 啟用中規格比較
| 參數 | AFS600-1FGG256 | M7AFS600-1FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| System Gates | 600,000 gates | 600K |
| User I/O | 119 I/O | — |
| 供應電壓 | 1.5 V | — |
| Logic Family | Flash-based CMOS | — |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal flash-based CMOS |
| Metal Layers | 7 layers | — |
| Package Type | 256-ball FBGA | — |
| Package Pin Count | 256 balls | — |
| Package Pitch | 1.0 mm | — |
| 工作溫度 | 0°C to 70°C | — |
| Configuration Memory | Embedded nonvolatile flash | Flash (nonvolatile) |
| Power-Up Configuration | Live at power-up | — |
| Integrated Analog Resources | Configurable analog blocks | — |
| Integrated Clock Management | Clock generation and management | — |
| Embedded Memory | Large flash memory blocks | — |
| Package Family | FBGA surface-mount package family | — |
| RoHS 狀態 | RoHS compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead-free | — |
| Pin Assignments | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| 工作電源電壓 | — | 1.5 V |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -1 |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| 封裝 / 外殼 | — | 256-Ball FBGA (FGG256) |
| 安裝方式 | — | SMD/SMT |
| Packaging | — | Tray |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |