AFS600-FGG484 vs A3PE600-FGG484 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci AFS600-FGG484 disebabkan oleh Microchip Technology dan A3PE600-FGG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ AktifPengandingan Spesifikasi
| Parametr | AFS600-FGG484 | A3PE600-FGG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600000 gates | 600000 |
| Maximum Frequency | 1098.9 MHz | — |
| Technology | 130 nm | — |
| Metal Layers | 7 layers | — |
| Process | Flash-based CMOS | — |
| Tegangan Pemberi Arus | 1.5 V | — |
| I/O Count | 172 I/O | — |
| Suhu Operasi | 0 C to 70 C | — |
| Kemasan | 484-pin FBGA; one verified source alternatively labels BGA-256 | FBGA-484 (PBGA484) |
| Configuration Retention | Nonvolatile flash | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Architecture | Monolithic mixed-signal FPGA | — |
| Programmable Logic | High-performance flash-based programmable logic | — |
| Analog Resources | Configurable analog resources | — |
| Flash Memory | Large flash-memory blocks | — |
| Clocking | Comprehensive clock generation and management circuitry | — |
| Processor Support | Optional ARM support | — |
| Jenis Pemasangan | Surface mount | — |
| Status Lingkungan Hidup | [DATA_NEEDED: current lifecycle status] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| Family | — | ProASIC3E |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Maximum System Frequency | — | 350 MHz |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Process Technology | — | 130 nm CMOS flash |
| Configuration Memory | — | On-chip flash (non-volatile, live at power-up) |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| Gaya Pemasangan | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Status RoHS | — | Green / [DATA_NEEDED: RoHS compliance detail] |
| Number of Pins / Balls | — | 484 |