DSP56F827FG80E vs DSP56F826BU80E Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci DSP56F827FG80E disebabkan oleh NXP Semiconductors dan DSP56F826BU80E disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
DSP56F827FG80E DSP56F827FG80E - 16-Bit DSC 80MHz 128KB Flash | NXP

DSP56F827FG80E - 16-Bit DSC 80MHz 128KB Flash | NXP

DSP56F827FG80E ✗ Akhir Hayat
NXP Semiconductors
DSP56F826BU80E DSP56F826BU80E - 16-Bit 80MHz DSC 64KB Flash | NXP

DSP56F826BU80E - 16-Bit 80MHz DSC 64KB Flash | NXP

DSP56F826BU80E ✗ Akhir Hayat

Pengandingan Spesifikasi

Parametr DSP56F827FG80E DSP56F826BU80E
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers DSP
Status Lingkungan Hidup Akhir Hidup Akhir Hidup
Core 56800 (56F8xx family) 56800E (16-bit)
Core Size 16-bit —
Core Frequency 80 MHz 80 MHz
Performance 40 MIPS at 80 MHz 40 MIPS
Program Flash 128KB (64K x 16) —
Program RAM [DATA_NEEDED: Program RAM size] —
Data RAM [DATA_NEEDED: Data RAM size] —
Data Flash [DATA_NEEDED: Data Flash size] —
Tegangan Pemberi Arus [DATA_NEEDED: Supply voltage range] [DATA_NEEDED: supply voltage range]
Suhu Operasi -40C to +85C [DATA_NEEDED: operating temperature range]
Oscillator 4 MHz crystal oscillator with PLL (integrated pre- and post-scalers) —
ADC Dual Analog to Digital Converters —
Timers Quad Timer Quad Timer
Communications Interfaces SCI, SPI, SSI —
Debug Interface JTAG / OnCE Debug Programming Interface JTAG/OnCE
Other Peripherals Time-of-Day module, GPIO, hardware DO and REP loops —
Kemasan 128-LQFP (14 x 20 mm) 100-LQFP (14 x 14 mm)
Jenis Pemasangan Surface Mount Surface Mount
Status Lingkungan Hidup End of Life (per NXP product page) —
Program Memory — 64KB (32K x 16) Flash
RAM Size — 4.5K x 16
Lebar Bus Data — 16-bit
Number of I/O — 46
Oscillator Type — External (4 MHz crystal with PLL)
Serial Interfaces — SCI, SPI, SSI
I/O Tolerance — 5V-tolerant, TTL-compatible inputs
Process Technology — High-density CMOS
Packaging — Tray

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