EP1AGX20CF780I6 vs EP1AGX35CF780I6N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1AGX20CF780I6 disebabkan oleh Intel dan EP1AGX35CF780I6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1AGX35CF780I6N EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP1AGX20CF780I6 EP1AGX35CF780I6N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family Arria GX Arria GX
Logic Elements (LE) 21,580 33,250
Number of LABs/CLBs 1,079 —
Total Embedded Memory 1,229,184 bits —
User I/O Pins 341 —
Core Voltage 1.2 V 1.2 V
Process Technology 90 nm CMOS 90 nm
Package Type 780-pin FC-FBGA (Fine-pitch Flip-chip BGA) —
Suhu Operasi -40 C to +100 C (Industrial) —
Speed Grade I6 I6
Number of Transceivers Up to 4 —
Transceiver Data Rate 600 Mbps to 3.125 Gbps —
Configuration Modes PS, FPP, JTAG —
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status not stated in verified sources]
Manufacturer — Intel (formerly Altera)
Device Series — EP1AGX35
Logic Array Blocks (LABs) — 33,520
Embedded Transceivers — Up to 3.125 Gbps
Transceiver Count — [DATA_NEEDED: transceiver count for EP1AGX35 in F780 package]
Kemasan — 780-pin Flip-Chip BGA (FC-FBGA)
Package Code — BGA-780
Package Dimensions — 29 x 29 mm
Terminal Pitch — 1.00 mm
Terminal Form — Ball
Terminal Shape — [DATA_NEEDED: terminal shape - confirmed SQUARE package per partstack]
Temperature Grade — Industrial
Gambaran Suhu Operasi — -40C to +100C (Industrial, I6 speed grade)

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