EP1K30FI256-2N vs EP1K30FC256-3NAA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1K30FI256-2N disebabkan oleh Intel dan EP1K30FC256-3NAA disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1K30FI256-2N | EP1K30FC256-3NAA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Typical Gates | 30,000 | — |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | 24576 bits |
| Maximum User I/O | 171 | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 200 MHz | — |
| Number of LABs | 216 | — |
| Kemasan | 256-ball FineLine BGA (FBGA) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Speed Grade | -2 | -3 (ordering code) |
| Programmable via | JTAG (IEEE 1149.1) | — |
| Jenis Ingatan | Dual-port Embedded Array Block (EAB) | — |
| Product Category | — | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | — | 1728 |
| Number of Gates | — | 30000 (30K) |
| Number of User I/Os | — | 171 |
| Maximum Internal Clock Frequency | — | 200 MHz |
| IC Process Technology | — | 0.22 um |
| Package Type | — | 256-ball FBGA (FineLine BGA) |
| Package Form | — | 256-BBGA |
| Configuration Type | — | SRAM-based, external configuration device required |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| I/O Supply Voltage | — | [DATA_NEEDED: VCCIO voltage options] |
| Power Dissipation | — | [DATA_NEEDED: typical power dissipation, design dependent] |
| Lead-Free / RoHS | — | [DATA_NEEDED: manufacturer PCN confirms RoHS status] |