EP1K30FI256-2N vs EP1K30FC256-3NAA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FI256-2N sa pamamagitan ng Intel at EP1K30FC256-3NAA sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30FI256-2N | EP1K30FC256-3NAA |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Typical Gates | 30,000 | — |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | 24576 bits |
| Maximum User I/O | 171 | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 200 MHz | — |
| Number of LABs | 216 | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Speed Grade | -2 | -3 (ordering code) |
| Programmable via | JTAG (IEEE 1149.1) | — |
| Uri ng Memory | Dual-port Embedded Array Block (EAB) | — |
| Product Category | — | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | — | 1728 |
| Number of Gates | — | 30000 (30K) |
| Number of User I/Os | — | 171 |
| Maximum Internal Clock Frequency | — | 200 MHz |
| IC Process Technology | — | 0.22 um |
| Package Type | — | 256-ball FBGA (FineLine BGA) |
| Package Form | — | 256-BBGA |
| Configuration Type | — | SRAM-based, external configuration device required |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| I/O Supply Voltage | — | [DATA_NEEDED: VCCIO voltage options] |
| Power Dissipation | — | [DATA_NEEDED: typical power dissipation, design dependent] |
| Lead-Free / RoHS | — | [DATA_NEEDED: manufacturer PCN confirms RoHS status] |