EP20K200CB356C8ES vs EP20K200CB356C7ES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K200CB356C8ES disebabkan oleh Intel dan EP20K200CB356C7ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP20K200CB356C8ES | EP20K200CB356C7ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Series | APEX 20KC | — |
| Family | APEX 20KC MultiCore Interconnect FPGA | APEX 20KC |
| System Gates | 200,000 | 200,000 |
| Logic Elements / Cells | 8,320 | 8,320 |
| User I/O Count | 271 | — |
| Core Voltage | 1.8 V | 1.8 V |
| Process Technology | 0.15 µm | 0.15 µm CMOS |
| Operating Frequency (max) | 301.21 MHz | 375.94 MHz |
| Package Type | 356-LBGA (Ball Grid Array) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | 0°C to +85°C (Commercial) | — |
| Speed Grade | C8 (8 ns) | — |
| Jenis Ingatan | SRAM-based, Embedded System Blocks (ESBs) | — |
| Programming Interface | JTAG / ByteBlaster / USB-Blaster | — |
| Design Software | Quartus II / MAX+PLUS II | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: rohs status] |
| Embedded Memory | Yes (ESBs) | — |
| Maximum User I/O | — | 271 |
| Kemasan | — | 356-Ball BGA (CB) |
| Embedded Memory Blocks | — | Yes (ESB - True Dual-Port / CAM) |
| PLLs | — | 4 |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Operating Temperature Grade | — | Commercial (0°C to +70°C) |