EP20K600CF1020C7 vs EP20K600CEF672C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K600CF1020C7 disebabkan oleh Altera dan EP20K600CEF672C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EP20K600CF1020C7 - APEX 20KC 600K Gates 1.8V FPGA | Altera
EP20K600CF1020C7 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP20K600CF1020C7 | EP20K600CEF672C7 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | APEX 20KC | APEX 20KC (Enhanced Configuration) |
| Manufacturer | Altera (now Intel) | Intel (formerly Altera) |
| Typical Gates | 311,000 | — |
| Maximum System Gates | 600,000 | — |
| Logic Elements / Cells | 24,320 | 24,320 |
| Maximum Operating Frequency | 375.94 MHz | 375.94 MHz |
| Process Technology | 0.15 micrometer CMOS | 0.15 µm CMOS, all-layer copper |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V (nominal 1.8 V) | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| User I/O Count | 588 | — |
| Total Inputs | 580 + 4 dedicated | — |
| Propagation Delay (Tpd) | 1.6 ns | — |
| Kemasan | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) | 672-ball FineLine BGA (FC-FBGA) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | — |
| Configuration Method | SRAM-based, serial/parallel passive or enhanced configuration device | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Series | — | APEX 20KC |
| Device Type | — | FPGA / Loadable PLD |
| Gate Count (typical) | — | 600,000 gates |
| Propagation Delay | — | 1.48 ns (typ) |
| User I/Os | — | 488 |
| Core Supply Voltage | — | 1.8 V |
| Package Code | — | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Suhu Operasi | — | 0 °C to +85 °C (commercial) |
| Configuration | — | SRAM-based, serial or parallel (EPC) |
| Embedded Memory | — | EAB blocks (dual-port RAM with byte enables) |
| LVDS Support | — | True-LVDS channels integrated |
| MultiVolt I/O | — | 1.8 V, 2.5 V, 3.3 V interfaces |
| External Memory Interface | — | DDR SDRAM, QDR SRAM |
| JTAG Support | — | IEEE 1149.1 boundary-scan |