EP2A25B652C9 vs EP2A25B652C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25B652C9 disebabkan oleh Intel dan EP2A25B652C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25B652C9 | EP2A25B652C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Device Family | APEX II (EP2A25) | — |
| Logic Elements | 24,320 | Approximately 25,000 LE |
| Kemasan | 652-ball FineLine BGA | 652-ball FineLine BGA |
| Speed Grade | C9 (-7 commercial) | -7 |
| Process Technology | 0.18 µm CMOS | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: commercial/industrial temperature range] | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage Standards | LVTTL, LVCMOS, SSTL, LVDS | — |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, MAX configuration scheme | — |
| Embedded Memory | Embedded array blocks (EABs) | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Maximum User I/O | [DATA_NEEDED: maximum usable I/O count for 652 BGA] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Family | — | APEX II |
| Embedded System Blocks (ESBs) | — | [DATA_NEEDED: ESB count] |
| Maximum User I/O Pins | — | 488 |
| Core Voltage | — | 1.5 V |
| I/O Bank Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Bits (approx.) | — | 40,960 |
| PLLs | — | 4 |
| Supported I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| Boundary Scan | — | IEEE 1149.1 compliant |
| Design Software | — | Quartus II |
| Suhu Operasi | — | Commercial 0C to +85C |