EP2A25F672C8N vs EP2A15F672C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672C8N disebabkan oleh Intel dan EP2A15F672C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672C8N | EP2A15F672C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | — |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | 500 MHz |
| Propagation Delay | 1.69 ns | — |
| User I/Os | 492 | 492 |
| Kemasan | 672-ball FC-FBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | -7 |
| Suhu Operasi | 0 C to 85 C (commercial) | Commercial (0C to +85C) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements (Cells) | — | 16,640 |
| Embedded Memory Bits | — | 425,984 |
| Process Technology | — | 0.15 µm all-layer copper CMOS |
| Metal Layers | — | Up to 8 |
| Core Voltage | — | 1.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Methods | — | JTAG, Passive Serial |