EP2A25F672I7 vs EP2A25F672I6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672I7 disebabkan oleh Intel dan EP2A25F672I6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672I7 | EP2A25F672I6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| Gate Count | 900,000 | — |
| Maximum Frequency | 500 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.18 µm CMOS |
| Core Voltage | 1.5 V | 1.5 V |
| Kemasan | 672-pin FC-FBGA | 672-ball FineLine BGA (FBGA-672) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 7 | 6 |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, LVDS | — |
| Embedded Memory | Yes (Embedded System Blocks) | Embedded System Blocks (ESB), dual-port RAM / CAM |
| Configuration Interface | JTAG | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |