EP2A25F672I7 vs EP2A25F672I6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I7 sa pamamagitan ng Intel at EP2A25F672I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672I7 | EP2A25F672I6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| Gate Count | 900,000 | — |
| Maximum Frequency | 500 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.18 µm CMOS |
| Core Voltage | 1.5 V | 1.5 V |
| Packhaging | 672-pin FC-FBGA | 672-ball FineLine BGA (FBGA-672) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 7 | 6 |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, LVDS | — |
| Embedded Memory | Yes (Embedded System Blocks) | Embedded System Blocks (ESB), dual-port RAM / CAM |
| Configuration Interface | JTAG | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |