EP2A40F672C6N vs EP2A40F672C9N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A40F672C6N disebabkan oleh Intel dan EP2A40F672C9N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A40F672C6N | EP2A40F672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | 38,400 |
| Maximum System Gates | 1,125,000 | — |
| Embedded RAM Bits | 442,368 | — |
| Embedded System Blocks (ESBs) | 160 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | — |
| Kemasan | 672-ball FineLine BGA | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Suhu Operasi | Commercial (0C to +85C) | 0 °C to +85 °C (commercial) |
| Speed Grade | C6 (per part number suffix) | C9 (~1.55 ns propagation delay) |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15 µm all-layer copper, up to 8 metal layers |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Device Name | — | EP2A40 |
| System Gates | — | 1,500,000 |
| User I/Os | — | 492 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Package Code | — | FC-FBGA / PBGA672 |
| Internal Frequency | — | 366 MHz |
| LVDS Data Rate | — | 1 Gbps |
| Propagation Delay | — | 1.55 ns |
| Logic Family | — | CMOS (SRAM-based configuration) |