EP2A40F672C8 vs EP2A40F672C9N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A40F672C8 disebabkan oleh Intel dan EP2A40F672C9N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A40F672C8 | EP2A40F672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Logic Family | CMOS | CMOS (SRAM-based configuration) |
| Typical Logic Elements (LEs) | 40,000 | — |
| Embedded Memory | Up to 1.5 Mbits | — |
| User I/Os | 492 pins | 492 |
| Bilangan Pin | 672 | — |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch | — |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper, up to 8 metal layers |
| Propagation Delay (speed grade C8) | 1.55 ns | — |
| Suhu Operasi | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial) |
| Phase-Locked Loops (PLLs) | 4 | — |
| LVDS Signaling Support | Up to 1 Gbps | — |
| Multipliers | Embedded multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Device Name | — | EP2A40 |
| System Gates | — | 1,500,000 |
| Logic Elements | — | 38,400 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Kemasan | — | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Package Code | — | FC-FBGA / PBGA672 |
| Speed Grade | — | C9 (~1.55 ns propagation delay) |
| Core Voltage | — | 1.5 V |
| Internal Frequency | — | 366 MHz |
| LVDS Data Rate | — | 1 Gbps |
| Propagation Delay | — | 1.55 ns |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance status] |