EP2A40F672C8 vs EP2A40F672C9N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F672C8 sa pamamagitan ng Intel at EP2A40F672C9N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40F672C8 | EP2A40F672C9N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Logic Family | CMOS | CMOS (SRAM-based configuration) |
| Typical Logic Elements (LEs) | 40,000 | — |
| Embedded Memory | Up to 1.5 Mbits | — |
| User I/Os | 492 pins | 492 |
| Bilang ng Pins | 672 | — |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch | — |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper, up to 8 metal layers |
| Propagation Delay (speed grade C8) | 1.55 ns | — |
| Temperature na Operasyon | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial) |
| Phase-Locked Loops (PLLs) | 4 | — |
| LVDS Signaling Support | Up to 1 Gbps | — |
| Multipliers | Embedded multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Device Name | — | EP2A40 |
| System Gates | — | 1,500,000 |
| Logic Elements | — | 38,400 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Packhaging | — | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Package Code | — | FC-FBGA / PBGA672 |
| Speed Grade | — | C9 (~1.55 ns propagation delay) |
| Core Voltage | — | 1.5 V |
| Internal Frequency | — | 366 MHz |
| LVDS Data Rate | — | 1 Gbps |
| Propagation Delay | — | 1.55 ns |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |