EP2A70F1508C7N vs EP2A70F1508C9 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A70F1508C7N disebabkan oleh Altera dan EP2A70F1508C9 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2A70F1508C7N | EP2A70F1508C9 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | APEX II | APEX II |
| Technology | 0.15 µm CMOS | — |
| Core Voltage | 1.5 V | — |
| Logic Cells | 67,200 cells | — |
| Logic Array Blocks | 6,720 LABs | — |
| Total RAM | 1,146,880 bits | — |
| Programmable I/O | 1,060 I/O pins | — |
| Maximum Stated Frequency | 420 MHz | — |
| Gate Capacity | 3 million gates | — |
| Kemasan | 1508-pin FC-FBGA | — |
| Suhu Operasi | 0°C to 85°C | 0 °C to 85 °C |
| Jenis Pemasangan | Surface mount | Surface Mount |
| Status RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Tegangan Panas | [DATA_NEEDED: thermal resistance] | — |
| Arus Pemberi Arus | [DATA_NEEDED: supply current] | — |
| Family | — | APEX II FPGA |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Kemasan / Case | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Speed Grade | — | C9 |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |
| Aras MSL | — | [DATA_NEEDED: MSL level] |