EP2AGX45CU17I3G vs EP2AGX45CU17I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX45CU17I3G disebabkan oleh Intel dan EP2AGX45CU17I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX45CU17I3N - Arria II GX FPGA, 42K LEs, 156 I/O, 358-FCBGA | Intel
EP2AGX45CU17I3N ✓ AktifPengandingan Spesifikasi
| Parametr | EP2AGX45CU17I3G | EP2AGX45CU17I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42,959 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | 3,517,440 |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Kemasan | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 (168 hours) | — |
| Status RoHS | Compliant | Compliant |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Number of LABs/CLBs | — | 1,805 |
| Number of I/O | — | 156 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.75 Gbps |
| Number of PLLs | — | 4 |
| Multiplier Elements (18x18) | — | 312 |
| Core Voltage | — | 0.9 V |
| Speed Grade | — | I3 |