EP2AGX45CU17I3G vs EP2AGX45CU17I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45CU17I3G sa pamamagitan ng Intel at EP2AGX45CU17I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX45CU17I3N - Arria II GX FPGA, 42K LEs, 156 I/O, 358-FCBGA | Intel
EP2AGX45CU17I3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX45CU17I3G | EP2AGX45CU17I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42,959 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | 3,517,440 |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Packhaging | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Number of LABs/CLBs | — | 1,805 |
| Number of I/O | — | 156 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.75 Gbps |
| Number of PLLs | — | 4 |
| Multiplier Elements (18x18) | — | 312 |
| Core Voltage | — | 0.9 V |
| Speed Grade | — | I3 |