EP2AGX45DF29C6G vs EP2AGX45DF29I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX45DF29C6G disebabkan oleh Intel dan EP2AGX45DF29I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel
EP2AGX45DF29I3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2AGX45DF29C6G | EP2AGX45DF29I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Series | Arria II GX | EP2AGX45 |
| Family | Intel FPGA (formerly Altera) | Arria II GX |
| Logic Elements (LE) | 45,000 | — |
| Embedded Memory Bits | 3,517,440 | — |
| User I/O Count | 364 | — |
| DSP 18x18 Multipliers | 312 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | — |
| Kemasan | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (DF29) |
| Speed Grade | C6 (commercial, mid-speed) | I3 |
| Process Node | 40 nm TSMC low-power | — |
| Suhu Operasi | 0C to +85C (commercial) | -40 C to +100 C (industrial) |
| Hard IP Blocks | PCIe Gen1/Gen2, External Memory Controller | — |
| Configuration | SRAM-based, volatile | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (168 hours) | — |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |