EP2AGX45DF29C6G vs EP2AGX45DF29I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29C6G sa pamamagitan ng Intel at EP2AGX45DF29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29C6G | EP2AGX45DF29I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Arria II GX | EP2AGX45 |
| Family | Intel FPGA (formerly Altera) | Arria II GX |
| Logic Elements (LE) | 45,000 | — |
| Embedded Memory Bits | 3,517,440 | — |
| User I/O Count | 364 | — |
| DSP 18x18 Multipliers | 312 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | — |
| Packhaging | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (DF29) |
| Speed Grade | C6 (commercial, mid-speed) | I3 |
| Process Node | 40 nm TSMC low-power | — |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 C to +100 C (industrial) |
| Hard IP Blocks | PCIe Gen1/Gen2, External Memory Controller | — |
| Configuration | SRAM-based, volatile | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |