EP2AGX65DF25I3N vs EP2AGX65DF25I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX65DF25I3N disebabkan oleh Intel dan EP2AGX65DF25I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3N ⚠ Bahagian terakhir untuk beliIntel
EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3G ✓ AktifPengandingan Spesifikasi
| Parametr | EP2AGX65DF25I3N | EP2AGX65DF25I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | 60,214 |
| Logic Array Blocks (LABs) | 2,530 | — |
| Total Embedded Memory | 2,531 Kbits | — |
| M9K Memory Blocks | 4.4 Mbits (approx 488 blocks) | — |
| MLAB Memory | 1.4 Mbits | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Transceivers | 8 channels | Up to 12 |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| User I/O Count | 252 | 252 |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C ambient) | Industrial (-40C to +100C) |
| Kemasan | 572-ball FCBGA (flip-chip BGA) | 572-ball FCBGA (Flip-Chip BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | AS, PS, FPP, JTAG |
| Hard IP for PCIe | PCIe Gen1 / Gen2 (x1/x2/x4) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Embedded Memory (bits) | — | 5,371,904 |
| Transceiver Data Rate | — | Up to 3.75 Gbps |
| Speed Grade | — | I3 |
| DSP Blocks | — | Yes (embedded multipliers) |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Jenis Pemasangan | — | Surface Mount |