EP2AGX65DF25I3N vs EP2AGX65DF25I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF25I3N sa pamamagitan ng Intel at EP2AGX65DF25I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3N ⚠ Huling PagbiliIntel
EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX65DF25I3N | EP2AGX65DF25I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | 60,214 |
| Logic Array Blocks (LABs) | 2,530 | — |
| Total Embedded Memory | 2,531 Kbits | — |
| M9K Memory Blocks | 4.4 Mbits (approx 488 blocks) | — |
| MLAB Memory | 1.4 Mbits | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Transceivers | 8 channels | Up to 12 |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| User I/O Count | 252 | 252 |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C ambient) | Industrial (-40C to +100C) |
| Packhaging | 572-ball FCBGA (flip-chip BGA) | 572-ball FCBGA (Flip-Chip BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | AS, PS, FPP, JTAG |
| Hard IP for PCIe | PCIe Gen1 / Gen2 (x1/x2/x4) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Embedded Memory (bits) | — | 5,371,904 |
| Transceiver Data Rate | — | Up to 3.75 Gbps |
| Speed Grade | — | I3 |
| DSP Blocks | — | Yes (embedded multipliers) |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Uri ng Pagpapasok | — | Surface Mount |