EP2AGZ300HF40C3G vs EP2AGZ350HF40C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300HF40C3G disebabkan oleh Intel dan EP2AGZ350HF40C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300HF40C3G | EP2AGZ350HF40C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | — |
| User I/O Count | 734 | — |
| Kemasan | 1517-ball FBGA | 1517-ball FCBGA (HF40) |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Suhu Operasi | Commercial (0C to +85C) | — |
| Embedded Memory | Approx. 18.7 Mbits | — |
| DSP Blocks | 800+ (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm low-power |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| Status RoHS | Pb-free finish - compliant | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Family | — | Arria II GZ |
| Logic Elements | — | 348,500 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceivers | — | Up to 24 (per family datasheet) |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |