EP2AGZ300HF40C3G vs EP2AGZ350HF40C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300HF40C3G sa pamamagitan ng Intel at EP2AGZ350HF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300HF40C3G | EP2AGZ350HF40C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria II GZ | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | — |
| User I/O Count | 734 | — |
| Packhaging | 1517-ball FBGA | 1517-ball FCBGA (HF40) |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Temperature na Operasyon | Commercial (0C to +85C) | — |
| Embedded Memory | Approx. 18.7 Mbits | — |
| DSP Blocks | 800+ (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm low-power |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| Tindminan RoHS | Pb-free finish - compliant | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Family | — | Arria II GZ |
| Logic Elements | — | 348,500 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceivers | — | Up to 24 (per family datasheet) |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |