EP2AGZ300HF40I4 vs EP2AGZ300HF40I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300HF40I4 disebabkan oleh Intel dan EP2AGZ300HF40I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300HF40I4 | EP2AGZ300HF40I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Arria II GZ | Arria II GZ |
| Family | Field-Programmable Gate Array (FPGA) | EP2AGZ |
| Manufacturer | Intel (formerly Altera) | — |
| Process Node | 40 nm | — |
| Logic Elements | 298,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 18,854,912 bits (18.85 Mbit) | — |
| Block RAM | 19,200 Kbits | — |
| Number of Logic Cells | 298,000 | — |
| Maximum User I/O Pins | 1192 | — |
| Number of Transceivers | Up to 24 | — |
| Transceiver Data Rate (max) | 6.375 Gbps (CPRI/OBSAI) | — |
| Number of PLLs | 8 | 4 |
| Core Voltage | 0.9 V (1.1 V option via SmartVoltage IDM) | — |
| Core Performance (max) | 500 MHz | — |
| Number of Global Clock Networks | 16 | — |
| Package Type | 1517-ball FC-FBGA | — |
| Operating Temperature Grade | Industrial (I4): -40C to +100C | Industrial (-40C to +100C) |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 298,000 |
| Embedded Memory Bits | — | 18,854,912 |
| User I/O Count | — | 734 |
| Kemasan | — | 1517-BBGA, FCBGA (HF40) |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 0.9 V |
| Process Technology | — | 40 nm |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | AES-256 |