EP2AGZ350FH29I3G vs EP2AGZ300FH29I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350FH29I3G disebabkan oleh Intel dan EP2AGZ300FH29I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ350FH29I3G | EP2AGZ300FH29I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 350000 (approximately) | — |
| Process Node | 40 nm | 40 nm |
| User I/O Count | 281 | — |
| Kemasan | 780-FBGA (FineLine BGA, FH29) | 780-FCBGA (H-BGA, 29x29 mm) |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Gambaran Suhu Operasi | -40C to +100C | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| Transceivers | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) | 12 |
| Memory Interface | DDR3 with read/write leveling support (family feature) | — |
| Embedded Multipliers | 18x18 hardware multipliers (family feature) | — |
| Configuration Method | Serial or parallel via Quartus II (family feature) | — |
| Aras MSL | 3 (per BGA package handling guidelines) | — |
| Status RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Boson Bebas | [DATA_NEEDED: halogen free status] | — |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory | — | 18,854,912 bits |
| User I/O Pins | — | 281 |
| Max Transceiver Speed | — | 6.375 Gbps |
| Core Voltage | — | 0.9 V |
| Speed Grade | — | I3 |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| PLLs | — | 8 (4 general-purpose + 4 transceiver) |
| Global Clock Networks | — | 16 |
| Status Lingkungan Hidup | — | End of Life (EOL) |