EP2C35F484C6 vs EP2C35F484I6N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C35F484C6 disebabkan oleh Intel dan EP2C35F484I6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2C35F484C6 EP2C35F484I6N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Family Cyclone II —
Logic Elements (LE) 33,216 —
Embedded Memory Bits 483,840 bits (105 M4K blocks x 4 Kbit) —
Embedded 18x18 Multipliers 35 35 (Cyclone II family maximum 150)
Maximum User I/O 322 —
Process Technology 90 nm low-k CMOS —
Core Voltage (VCCINT) 1.2 V —
PLL Analog Supply (VCCA) 2.5 V —
I/O Standards LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), SSTL, HSTL, PCI, differential LVDS, RSDS —
Kemasan 484-ball FineLine BGA (FBGA) 484-ball FBGA (Fine-Pitch BGA)
Speed Grade -6 —
Operating Temperature (Commercial) 0 C to +85 C —
PLLs 4 —
Global Clock Networks 16 —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Status RoHS Compliant Compliant
Lead-Free Yes —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Logic Elements — 33,216
Logic Array Blocks (LABs) — 2,100
Total RAM Bits — 483,840 bits (483.84 Kbit on-chip)
Phase-Locked Loops (PLLs) — 4
Maximum User I/O Pins — 322 (package-dependent; FBGA-484 supports up to 322 user I/O)
Logic Family — CMOS
Core Supply Voltage — 1.2 V
Gambaran Suhu Operasi — -40C to +85C (industrial)
Maximum Internal Clock Frequency — 402.5 MHz
Process Node — 90 nm TSMC CMOS
Configuration Method — Serial / Parallel (via Altera/Intel configuration device or JTAG)

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