EP2C8F256I8N vs EP2C8F256C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C8F256I8N disebabkan oleh Intel dan EP2C8F256C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2C8F256C7 - Cyclone II FPGA, 8K LEs, 256-FBGA | Intel
EP2C8F256C7 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2C8F256I8N | EP2C8F256C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Operasi | -40C to +85C (industrial) | 0C to +85C (commercial, TJ) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: RoHS status] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 8,256 |
| Embedded Multipliers | — | 36 (18x18) |
| Number of Logic Array Blocks (LABs) | — | 516 |
| Maximum User I/O | — | 182 |
| Number of PLLs | — | 2 |
| Kemasan | — | 256-LBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C7 (commercial, 7th bin) |