EP2S180F1020C3 vs EP2S180F1020C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1020C3 disebabkan oleh Intel dan EP2S180F1020C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2S180F1020C3 | EP2S180F1020C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | Stratix II | Stratix II |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | 8,970 |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Kemasan | 1020-ball FBGA (flip-chip BGA) | 1020-BBGA, FCBGA (33 x 33 mm, 1.0 mm pitch) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Speed Grade | C3 | C5 |
| Suhu Operasi | Commercial (0C to +85C) | 0 C to +85 C (commercial) |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs_status] |
| Family | — | Stratix II |
| Logic Elements (LE) | — | 179,400 |
| Configurable Logic Blocks (CLBs) | — | 71,760 |
| Total RAM Bits | — | 9,383,040 |
| User I/O Pins | — | 742 |
| Process Technology | — | 90 nm CMOS |
| Configuration Mode | — | JTAG / Passive Serial / Passive Parallel / Active Serial |
| Number of Transceivers | — | [DATA_NEEDED: transceiver_count] |