EP2SGX30DF780C7 vs EP2SGX30DF780I4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780C7 disebabkan oleh Intel dan EP2SGX30DF780I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX30DF780I4 EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel

EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel

EP2SGX30DF780I4 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX30DF780C7 EP2SGX30DF780I4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family Stratix II GX Stratix II GX
Series Stratix II GX Stratix II GX
Logic Elements (LE) 33,880 —
Embedded Memory (bits) 1,369,728 —
Memory Blocks 482 (M512/M4K/M-RAM) —
DSP Blocks 24 —
18x18 Multipliers 192 —
Maximum User I/O 361 —
Speed Grade -7 —
Kemasan 780-Ball FBGA (DF780), 1.0 mm pitch 780-ball FC-FBGA, 29x29 mm, 1 mm pitch
Suhu Operasi 0C to +85C (Commercial) -40C to +85C (Industrial)
Process Node 90 nm —
Core Voltage (VCCINT) 1.2 V (typ) —
Configuration PS / FPP / JTAG —
Transceiver Data Rate [DATA_NEEDED: SERDES data rate] —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Logic Elements / Cells — 33,880
Total RAM Bits — 1,369,728
Number of LABs — 1,694
User I/O Count — 361
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Nominal Supply Voltage (Core) — 1.2 V
Internal Operating Frequency — 622 MHz
Frekuensi Klock Maksimum — 717 MHz
Process Technology — 90 nm CMOS
Jenis Pemasangan — Surface Mount (Flip-chip BGA)
Lead-Free — [DATA_NEEDED: lead-free status]
Aras MSL — [DATA_NEEDED: MSL level]
Number of Transceivers — [DATA_NEEDED: number of transceiver channels]
Number of PLLs / DLLs — [DATA_NEEDED: number of PLLs]

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